NO 05 Item Scratches Criterion Follow NO.3 LCD black spots, white spots, contamination AQL Symbols Define: x: Chip length y: Chip width z: Chip thickness k: Seal width t: Glass thickness a: LCD side length L: Electrode pad length: 6.1 General glass chip : 6.1.1 Chip on panel surface and crack between panels: z: Chip thickness 06 Chipped glass Z≦1/2t 1/2t＜z≦2t y: Chip width Not over viewing area Not exceed 1/3k x: Chip length x≦1/8a x≦1/8a 2.5 ☉If there are 2 or more chips, x is total length of each chip. 6.1.2 Corner crack: z: Chip thickness Z≦1/2t 1/2t＜z≦2t y: Chip width Not over viewing area Not exceed 1/3k x: Chip length x≦1/8a x≦1/8a ☉If there are 2 or more chips, x is the total length of each chip.
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NO Item Criterion Symbols : x: Chip length y: Chip width z: Chip thickness k: Seal width t: Glass thickness a: LCD side length L: Electrode pad length 6.2 Protrusion over terminal : 6.2.1 Chip on electrode pad : AQL y: Chip width y≦0.5mm x: Chip length x≦1/8a z: Chip thickness 0 ＜ z ≦ t 6.2.2 Non-conductive portion: 06 Glass crack 2.5 y: Chip width y≦ L x: Chip length x≦1/8a z: Chip thickness 0 ＜ z ≦ t ☉If the chipped area touches the ITO terminal, over 2/3 of the ITO must remain and be inspected according to electrode terminal specifications. ☉If the product will be heat sealed by the customer, the alignment mark not be damaged. 6.2.3 Substrate protuberance and internal crack. y: width y≦1/3L x: length x ≦ a
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NO 07 Item Criterion AQL 2.5 0.65 2.5 0.65 Cracked glass The LCD with extensive crack is not acceptable. 8.1 Illumination source flickers when lit. 8.2 Spots or scratched that appear when lit must be judged. Using LCD spot, lines and contamination standards. 8.3 Backlight doesn’t light or color wrong. 9.1 Bezel may not have rust, be deformed or have fingerprints, stains or other contamination. 9.2 Bezel must comply with job specifications. 10.1 COB seal may not have pinholes larger than 0.2mm or contamination. 10.2 COB seal surface may not have pinholes through to the IC. 10.3 The height of the COB should not exceed the height indicated in the assembly diagram. 10.4 There may not be more than 2mm of sealant outside the seal area on the PCB. And there should be no more than three places. 10.5 No oxidation or contamination PCB terminals. 10.6 Parts on PCB must be the same as on the production characteristic chart. There should be no wrong parts, missing parts or excess parts. 10.7 The jumper on the PCB should conform to the product characteristic chart. 10.8 If solder gets on bezel tab pads, LED pad, zebra pad or screw hold pad, make sure it is smoothed down. 10.9 The Scraping testing standard for Copper Coating of PCB X 08 Backlight elements 09 Bezel 2.5 0.65 2.5 2.5 0.65 2.5 2.5 0.65 0.65 2.5 2.5 10 PCB、COB Y X * Y<=2mm2 2.5 2.5 2.5 0.65 11 Soldering 11.1 No un-melted solder paste may be present on the PCB. 11.2 No cold solder joints, missing solder connections, oxidation or icicle. 11.3 No residue or solder balls on PCB. 11.4 No short circuits in components on PCB.
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NO Item Criterion 12.1 No oxidation, contamination, curves or, bends on interface Pin (OLB) of TCP. 12.2 No cracks on interface pin (OLB) of TCP. 12.3 No contamination, solder residue or solder balls on product. 12.4 The IC on the TCP may not be damaged, circuits. 12.5 The uppermost edge of the protective strip on the interface pin must be present or look as if it cause the interface pin to sever. 12.6 The residual rosin or tin oil of soldering (component or chip component) is not burned into brown or black color. 12.7 Sealant on top of the ITO circuit has not hardened. 12.8 Pin type must match type in specification sheet. 12.9 LCD pin loose or missing pins. 12.10 Product packaging must the same as specified on packaging specification sheet. 12.11 Product dimension and structure must conform to product specification sheet. AQL 2.5 0.65 2.5 2.5 2.5 2.5 2.5 0.65 0.65 0.65 0.65 12 General appearance
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