[3] 王正道，姚凯，丁克勤 金属磁记忆法研究进展. 无损检测 2009 31(12):1011-1014.

[4] Z. D. Wang, Z. F. Li, Z. Y. Xiong, R. N. Chang. Modeling Thermomechanical Behaviors of Shape Memory Polymer, Applied Polymer Science 2009;113(1):651-656 (SCI/EI检索)

[5] Z.D. Wang， X.X. Zhao. Fatigue behavior and life prediction of PI/SiO2

nanocomposite

films，

Applied

Polymer

Science

2009;112(6):3276-3283 (SCI/EI检索)

[6] Z.D. Wang，Z.F. Li, Y.S. Wang. Micro-buckling solution of elastic memory laminates under bending. JIMSS 2009;20:1565-1572. (SCI/EI检索)

[7] 王正道，李郑发，熊志远，畅若妮. EMC变形机理及在空间展开结构中的应用. 宇航学报 2009;30(1):190-194. (EI检索)

[8] 李郑发，王正道，熊志远，畅若妮, 形状记忆聚合物热力学本构方程. 高分子学报 2009;1:23-27 (SCI/EI检索)

http://jiaoshuotang.xxxedu.net/

[9] 李郑发，王正道. 形状记忆聚合物热力学本构模型研究进展. 高分子材料科学与工程 2009; 25(5):171-174 (EI检索)

[10] Z.Y. Xiong, Z.D.Wang, Z.F. Li, R.N. Chang, Micromechanism of deformation in EMC laminates, Materials Science and Engineering A 2008;496:323-328. (SCI/EI检索)

[11] Z.D.Wang, X.X.Zhao. Modeling and characterization of

viscoelasticity of PI/SiO2 nanocomposite films under constant and fatigue loads, Mat Sci Eng A, 2008;486:517-527. (SCI/EI检索)

[12] Z.D.Wang, X.X. Zhao. Creep resistance of PI/SiO2 hybrid thin films under constant and fatigue loading, Composites Part A , 2008;39:439-447. (SCI/EI检索)

[13] Yonghua Wang, Zhengdao Wang, Xiaoyan Liang, Minzhe An. Experimental and numerical studies on the dynamic compressive behavior of RPCs, Acta Mechanica Solida Sinica, 2008;21(5):420-430 (SCI/EI检索)

http://jiaoshuotang.xxxedu.net/

[14] Y.H. Wang, Z.D. Wang, X.X. Zhao. Prediction of the fatigue life based on stiffness degradation concept, Advanced Materials Research, 2008;33-37:199-204

[15] 王勇华, 梁小燕, 王正道, 安明喆, 阎贵平. 活性粉末混凝土冲击动力学性能研究, 工程力学 2008;25(11):167-172. (EI检索)

[16] 赵欣欣, 王正道. 聚酰亚胺无机杂化薄膜疲劳性能实验研究 工程力学 2008;25(5):67-72.

(EI检索)

[17] Z.D. Wang, J.J Lu. Essential and non-essential work of fracture of PI/SiO2 hybrid thin films of thermal expansion of stressed thin films, Appl Compos Mater，2007;14:33-45. (SCI/EI检索)

[18] Z.D. Wang, S.Q. Jiang, Potential experimental error for

CTE

of

stressed

thin

films,

Polymer

Testing,

determining

2007;26(1):116-121. (SCI/EI检索)

http://jiaoshuotang.xxxedu.net/

[19] Z.D. Wang, J.J. Lu. Evaluation of silica content on fracture toughness

of

PI/SiO2

hybrid

films.

Key

Eng

Mater

2007;353-358:1814-1817. (SCI/EI检索)

[20] Z.D. Wang, X.X. Zhao. Cyclic Deformation and Fracture of PI/SiO2 Thin Films. International

Conference on Advances and Trends in Engineering Materials and their Applications. Montreal, Canada, August 06 -10, 2007, 141-151.

[21] WANG Zheng-dao, JIANG Shao-qing, Coefficient of thermal expansion of stressed thin films. Trans Nonferrous Mat Soc China, 2006;16:s220-s225. (SCI/EI检索)

[22] Zheng-dao Wang， Jian-Jun Lu， Yan. Li, Shao-yun Fu, Shao-qing Jiang，Xin-Xin Zhao. Studies on thermal and mechanical properties of PI/SiO2 nanocomposite films at low temperature. Composite Part A, 2006; 37:74-79. (SCI/EI检索)

http://jiaoshuotang.xxxedu.net/